GLTRS--Glenn
TITLE AND SUBTITLE:
Design Evaluation Using Finite Element Analysis of Cooled Silicon Nitride Plates for a Turbine Blade Application

AUTHOR(S):
Ali Abdul-Aziz, George Y. Baaklini, and Ramakrishna T. Bhatt

REPORT DATE:
June 2001

FUNDING NUMBERS:
WU-708-31-13-00

PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES):
National Aeronautics and Space Administration
John H. Glenn Research Center at Lewis Field
Cleveland, Ohio 44135-3191

PERFORMING ORGANIZATION REPORT NUMBER:
E-12735

SPONSORING/MONITORING AGENCY NAME(S) AND ADDRESS(ES):
National Aeronautics and Space Administration
Washington, DC 20546-0001

REPORT TYPE AND DATES COVERED:
Technical Memorandum

SPONSORING/MONITORING AGENCY REPORT NUMBER:
NASA TM-2001-210819

SUPPLEMENTARY NOTES:
Prepared for the 103rd Annual Meeting and Exposition sponsored by The American Ceramic Society, Indianapolis, Indiana, April 22-25, 2001. Ali Abdul-Aziz, Cleveland State University, 1983 E. 24th Street, Cleveland, Ohio 44115-2403 (NASA Resident Research Associate at Glenn Research Center); George Y. Baaklini, NASA Glenn Research Center; Ramakrishna T. Bhatt, U.S. Army Research Laboratory, Glenn Research Center, Cleveland, Ohio 44135. Responsible person, Ali Abdul-Aziz, organization code 5920, 216-433-6729.


ABSTRACT:
Two- and three-dimensional finite element analyses were performed on a prototype plate specimen with cooling holes made of ceramic materials. Steady-state heat-transfer analyses were done to evaluate the thermal environment experienced by the specimen and to optimize the size of the cooling holes and the geometry of the cooling channels to reduce thermal stresses and burner rig testing. The limited experimental data available were used to model the thermal profile exerted by the flame on the plate. Thermal stress analyses were made to evaluate the stress response due to thermal loading. Contours for the temperature and the representative stresses for the specimen were generated and presented for different cooling hole sizes and shapes. The thermal barrier coating experienced high stresses, and the temperature gradient was much reduced when cooling holes were used. The advantages and disadvantages of several cooling channel layouts were evaluated.

SUBJECT TERMS:
Ceramics; Finite element; Cooling plates; Silicon nitrides; Thermal stress analysis

NUMBER OF PAGES:
21

PDF AVAILABLE FROM URL:
2001/TM-2001-210819.pdf
( 3,612 KB )

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